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Amaoe BGA Reballing Stencil For xiaomi Redmi phone CPU RAM PMIC AUDIO WIFI power charger IC Chip Solder BGA Heating Template

Home » Tools » Welding & Soldering Supplies » Amaoe BGA Reballing Stencil For xiaomi Redmi phone CPU RAM PMIC AUDIO WIFI power charger IC Chip Solder BGA Heating Template
Enlarge Amaoe BGA Reballing Stencil For xiaomi Redmi phone CPU RAM PMIC AUDIO WIFI power charger IC Chip Solder BGA Heating Template
Amaoe BGA Reballing Stencil For xiaomi Redmi phone CPU RAM PMIC AUDIO WIFI power charger IC Chip Solder BGA Heating Template enlarge
Amaoe BGA Reballing Stencil For xiaomi Redmi phone CPU RAM PMIC AUDIO WIFI power charger IC Chip Solder BGA Heating Template enlarge
Amaoe BGA Reballing Stencil For xiaomi Redmi phone CPU RAM PMIC AUDIO WIFI power charger IC Chip Solder BGA Heating Template enlarge
Amaoe BGA Reballing Stencil For xiaomi Redmi phone CPU RAM PMIC AUDIO WIFI power charger IC Chip Solder BGA Heating Template enlarge
Amaoe BGA Reballing Stencil For xiaomi Redmi phone CPU RAM PMIC AUDIO WIFI power charger IC Chip Solder BGA Heating Template enlarge
Amaoe BGA Reballing Stencil For xiaomi Redmi phone CPU RAM PMIC AUDIO WIFI power charger IC Chip Solder BGA Heating Template enlarge
Price from: 50.85 $
Prices are approximate and are indebted to the time of inclusion in the product catalog.

Description:

Amaoe BGA Reballing Stencil For xiaomi Redmi phone CPU RAM PMIC AUDIO WIFI power charger IC Chip Solder BGA Heating Template
The Amaoe BGA Reballing Stencil is an essential tool for repairing and reworking Xiaomi Redmi phone components such as CPU, RAM, PMIC, AUDIO, WIFI, power charger IC, and Chip Solder. This heating template is designed to facilitate the precise reballing process, ensuring a reliable and efficient repair. Whether you are a professional technician or a DIY enthusiast, this stencil is a must-have for any Redmi phone repair project.

Crafted with high-quality materials, the Amaoe BGA Reballing Stencil offers durability and longevity. Its precise design and layout ensure accurate alignment, making it easier to reball various Xiaomi Redmi phone components. With this stencil, you can confidently rework and repair BGA chips without worrying about misalignment or damage to surrounding components.

The Amaoe BGA Reballing Stencil is user-friendly and suitable for both beginners and experienced technicians. Its heat-resistant properties allow for safe and efficient heating during the reballing process. This stencil is an indispensable tool for anyone looking to repair or upgrade Xiaomi Redmi phone components, ensuring optimal performance and extending the lifespan of your device.

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