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Amaoe OPPO Find N Middle Layer BGA Reballing Stencil Motherboard CPU IC Chip Magnetic Steel Mesh Tin Planting Net 0.12mm

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Price from: 50.30 $
Prices are approximate and are indebted to the time of inclusion in the product catalog.

Description:

Amaoe OPPO Find N Middle Layer BGA Reballing Stencil Motherboard CPU IC Chip Magnetic Steel Mesh Tin Planting Net 0.12mm
Introducing the Amaoe OPPO Find N Middle Layer BGA Reballing Stencil, the ultimate solution for repairing and reballing the motherboard CPU IC chip of your OPPO Find N smartphone. This high-quality stencil is crafted with precision using magnetic steel mesh, ensuring durability and accuracy in every use. With a thickness of 0.12mm, it provides the perfect balance between flexibility and sturdiness, making it an indispensable tool for any professional technician or DIY enthusiast.

The Amaoe OPPO Find N Middle Layer BGA Reballing Stencil is designed to facilitate the reballing process, which involves replacing the solder balls on the motherboard CPU IC chip. The tin planting net on the stencil ensures a secure and reliable connection between the solder balls and the chip, guaranteeing optimal performance and longevity. Its compatibility with the OPPO Find N model ensures a perfect fit, allowing you to effortlessly reball the chip without any complications or errors.

With its exceptional build quality and precise design, the Amaoe OPPO Find N Middle Layer BGA Reballing Stencil is a must-have tool for any professional repair technician or hobbyist. Whether you are repairing a faulty motherboard or upgrading the CPU IC chip, this stencil provides the necessary support and accuracy to achieve outstanding results. Invest in this reliable and efficient reballing stencil to enhance your repair capabilities and restore your OPPO Find N smartphone to its full potential.

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