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Amaoe SAM8 BGA Reballing Stencil For Samsung NOTE4 APQ8084 CPU BGA529 EMCP RAM Power Wifi IC Chip Steel Mesh 0.12mm

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Amaoe SAM8 BGA Reballing Stencil For Samsung NOTE4 APQ8084 CPU BGA529 EMCP RAM Power Wifi IC Chip Steel Mesh 0.12mm enlarge
Price from: 50.26 $
Prices are approximate and are indebted to the time of inclusion in the product catalog.

Description:

Amaoe SAM8 BGA Reballing Stencil For Samsung NOTE4 APQ8084 CPU BGA529 EMCP RAM Power Wifi IC Chip Steel Mesh 0.12mm
Introducing the Amaoe SAM8 BGA Reballing Stencil, a high-quality tool designed specifically for reballing the Samsung NOTE4 APQ8084 CPU BGA529 EMCP RAM Power Wifi IC Chip Steel Mesh. This stencil is an essential accessory for technicians and enthusiasts involved in the repair and maintenance of Samsung devices. With a thickness of just 0.12mm, it offers exceptional precision and accuracy during the reballing process.

Crafted from durable steel mesh, the Amaoe SAM8 BGA Reballing Stencil ensures long-lasting performance and reliability. Its sturdy construction allows for repeated use without compromising on quality. The stencil is specifically designed for the Samsung NOTE4 APQ8084 CPU BGA529 EMCP RAM Power Wifi IC Chip, making it the perfect choice for professionals who frequently work with this particular model.

The 0.12mm thickness of the stencil guarantees optimal contact with the components, facilitating efficient and effective reballing. This level of precision is crucial when dealing with delicate electronic components, as it minimizes the risk of damage during the reballing process. The Amaoe SAM8 BGA Reballing Stencil is an indispensable tool for anyone looking to perform professional-grade repairs on Samsung NOTE4 devices, ensuring seamless functionality and prolonging the lifespan of these devices.

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