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MiJing 14 IN 1 BGA Reballing Stencil for iPhone 13 12 11 Pro Max XS X Motherboard Middle Frame Planting Tin Platform

Home » Tools » Welding & Soldering Supplies » MiJing 14 IN 1 BGA Reballing Stencil for iPhone 13 12 11 Pro Max XS X Motherboard Middle Frame Planting Tin Platform
Enlarge MiJing 14 IN 1 BGA Reballing Stencil for iPhone 13 12 11 Pro Max XS X Motherboard Middle Frame Planting Tin Platform
MiJing 14 IN 1 BGA Reballing Stencil for iPhone 13 12 11 Pro Max XS X Motherboard Middle Frame Planting Tin Platform enlarge
MiJing 14 IN 1 BGA Reballing Stencil for iPhone 13 12 11 Pro Max XS X Motherboard Middle Frame Planting Tin Platform enlarge
MiJing 14 IN 1 BGA Reballing Stencil for iPhone 13 12 11 Pro Max XS X Motherboard Middle Frame Planting Tin Platform enlarge
MiJing 14 IN 1 BGA Reballing Stencil for iPhone 13 12 11 Pro Max XS X Motherboard Middle Frame Planting Tin Platform enlarge
MiJing 14 IN 1 BGA Reballing Stencil for iPhone 13 12 11 Pro Max XS X Motherboard Middle Frame Planting Tin Platform enlarge
MiJing 14 IN 1 BGA Reballing Stencil for iPhone 13 12 11 Pro Max XS X Motherboard Middle Frame Planting Tin Platform enlarge
Price from: 56.93 $
Prices are approximate and are indebted to the time of inclusion in the product catalog.

Description:

MiJing 14 IN 1 BGA Reballing Stencil for iPhone 13 12 11 Pro Max XS X Motherboard Middle Frame Planting Tin Platform
Introducing the MiJing 14 IN 1 BGA Reballing Stencil, a must-have tool for anyone working with iPhone 13, 12, 11 Pro Max, XS, and X motherboard middle frame planting tin platform. This versatile stencil is designed to provide precise and efficient reballing of BGA (Ball Grid Array) chips, ensuring optimal performance and reliability.

Crafted with utmost precision, the MiJing 14 IN 1 BGA Reballing Stencil is made from high-quality materials that guarantee durability and longevity. The stencil features 14 different patterns, specifically tailored to fit various iPhone models, allowing you to effortlessly reball the motherboard middle frame planting tin platform. Whether you are a professional technician or a DIY enthusiast, this stencil offers the perfect solution for reballing needs, ensuring seamless repairs and replacements.

With its user-friendly design, the MiJing 14 IN 1 BGA Reballing Stencil simplifies the reballing process, making it accessible to both beginners and experienced technicians. The stencil's precise patterns and cutouts ensure accurate alignment and placement of BGA chips, minimizing the risk of errors and damage during the reballing process. Additionally, its compact size and lightweight construction make it easy to handle and store, making it a portable and convenient tool for on-the-go repairs. Upgrade your reballing experience with the MiJing 14 IN 1 BGA Reballing Stencil and achieve professional

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